The Ball Grid Array (BGA) is a type of surface-mount packaging (a chip carrier) for an integrated circuit with 132balls which can provide more interconnection of flat package type. It with high density, heat conduction, and low inductance.
The BGA packages are with lower thermal resistance between the package and the PCB, it allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating. The BGA with its very short distance between the package and the PCB, have low lead inductances, giving them a superior electrical performance to pinned devices. We support the BGA package with the NAND flashes storage technical solutions which are mainly used for SSD or USB Flash Drive chips.